Sealed pixel assemblies, kits and methods

ABSTRACT

Discrete flexible pixel assemblies can be hermetically sealed from the environment and can comprise unitary, self-contained replaceable modules which enable efficient, economical production of large scale, free-form electronic displays, signs and lighting effects for outdoor use. The method and means for producing hermetically sealed discrete flexible pixel assemblies can include encapsulation means, exterior encasement means, and cable connector means.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims priority to U.S. patent application Ser. No. 12/987,584, filed Jan. 10, 2011, entitled “SEALED PIXEL ASSEMBLIES, KITS AND METHODS,” which is a continuation of and claims priority to U.S. patent application Ser. No. 11/895,424, filed Aug. 24, 2007, assigned U.S. Pat. No. 7,868,903, entitled “FLEXIBLE PIXEL ELEMENT FABRICATION AND SEALING METHOD.” U.S. patent application Ser. No. 11/895,424 claims priority from U.S. Provisional Application No. 60/926,706 filed Apr. 27, 2007, entitled “FLEXIBLE PIXEL ASSEMBLIES FOR MOUNTING ON IRREGULAR SURFACES,” and is a continuation-in-part of U.S. patent application Ser. No. 10/965,133 filed Oct. 14, 2004, entitled “FLEXIBLE PIXEL STRING HARDWARE AND METHOD,” assigned U.S. Pat. No. 7,893,948, the entirety of each of the disclosures of which are explicitly incorporated by reference herein.

This application is also related to U.S. patent application Ser. No. 10/965,127 filed Oct. 14, 2004, entitled “FLEXIBLE PIXEL STRING SOFTWARE AND METHOD”, now abandoned, U.S. patent application Ser. No. 11/805,513 filed May 23, 2007, entitled “TRANSLATION TABLE,” assigned U.S. Pat. No. 8,001,455, and U.S. patent application Ser. No. 11/895,423 filed Aug. 24, 2007, entitled “FLEXIBLE PIXEL ELEMENT AND SIGNAL DISTRIBUTION MEANS,” assigned U.S. Pat. No. 8,344,410, the entirety of each of the disclosures of which are explicitly incorporated by reference herein.

TECHNICAL FIELD

The present invention teaches a discrete flexible pixel assembly for use in flexible pixel strings and, more particularly, a fabrication method and means for hermetic sealing of discrete flexible pixel assemblies.

Flexible pixel assemblies may be used in large scale, direct view electronic display devices and signage mounted on large area and/or irregular surfaces, such as the interior or exterior of buildings, where the intent is to complement the surface architecture of the building by conforming to the building surfaces. A particular problem arises with electronic display devices used in outdoor or exterior displays such as signs since delicate electronic components in such displays are exposed to the detrimental effects of environment, rough handling and inclement weather and are therefore vulnerable to failure. The discrete flexible pixel assembly, fabrication method and means for hermetic sealing of the present invention precludes failure of electronic components due to the detrimental effects of environment, thereby enabling efficient, economical production of large scale, direct view electronic display devices, signage and lighting effects for outdoor use.

BACKGROUND

Electronic display devices and signage are known in the art. An electronic display device typically comprises a display board that produces visual images by means of a grid of small light emitting elements, such as incandescent bulbs, LEDs, or the like; data handling and control means for managing transfer of digital image data for display as visual output images, and means for converting digital image data into visual image data and display control signals to drive the light emitting elements, or pixels, to thereby produce visual output images on the electronic display devices for viewing.

The sophistication of visual images that can be displayed on electronic display devices is generally dependent on the capabilities of the light emitting elements, or pixels, used to produce visual images. Light emitting display technology has become increasingly more advanced in the art, progressing from monochrome incandescent and LED devices to video quality components capable of exhibiting near continuous tone visual output, complex animations and live video streams. Improvements in light emitting display technology, including light emitting elements, have in turn enabled the manufacture of electronic display devices that are increasingly large in scale and more powerful in terms of the complexity and sophistication of the visual output images that can be displayed.

Electronic display devices and signage sited in outdoor locations, such as on the exterior surfaces of buildings, are also known in the art. Outdoor electronic display devices and signage are commonly sited near public venues where the visual output images they exhibit may be viewed simultaneously by large numbers of people in groups. Outdoor electronic display devices provide a valuable service to the public since they can provide timely or time-critical information, such as stock and commodity prices, traffic and weather conditions, hazard alerts, and other important information. One popular type of outdoor electronic display device is a large scale video for advertising displays and signage where commercial messages are broadly and effectively exhibited for public viewing.

An inherent problem in the design and manufacture of large scale electronic display devices for outdoor use is the need to protect delicate and vulnerable internal electronic components from failure due to the detrimental effects of environment. This problem is exacerbated by the increasing sophistication of light emitting elements and their collateral support electronics, such as the electronic drivers for the light emitting elements. In the early art, incandescent bulbs served as light emitting elements. Incandescent bulbs are comparatively inexpensive to use, robust in operation and easy to replace; moreover, they require few and comparatively inexpensive collateral support electronics and power and signal conductors. More advanced light emitting elements or pixels, such as LEDs and LCDs, are more expensive to use and replace. In addition, they require more numerous and more expensive collateral support electronics, including pixel element drivers, data buffers, control signal handlers, over-voltage and transient protection circuits, to name a few. Furthermore, advanced light emitting elements and collateral support electronics are comparatively much more delicate and easily damaged by electrostatic shock, thermal shock, mechanical shock, moisture and humidity, and various other detrimental environmental conditions. Advanced light emitting elements and collateral support electronics also require more sophisticated means of mounting and electrical connection, such as surface mounted printed circuit boards (PCBs), as well as more sophisticated means of supplying operating power, digital image data and display control signals, which means greatly increase the number of signal paths and conductors needed to service components and thereby greatly increase the number of connection points and potential points of failure. Therefore, the use of advanced light emitting elements, while presenting advantages in terms of the sophistication of visual output images that can be displayed, also presents a vulnerable design architecture with many potential points of failure.

In the prior art, light emitting elements are collectively sealed within enclosures to protect them from the outside environment. Not only does this add to the cost of producing already expensive large scale outdoor electronic displays and signage, but such enclosures are generally effective only for conventional, rectilinear or planar displays mounted on flat surfaces. Producing collective enclosures that conform to irregular shaped surfaces can be a complex and costly undertaking. Moreover, a collective enclosure typically embodies a single-point failure mode, wherein any failure of the collective enclosure exposes all the light emitting elements, collateral support electronics and connection points contained therein to potential failure. Finally, collective enclosures are subject to overheating from both internal and external sources, including component power dissipation and solar radiation.

A solution to some of these problems is taught in co-pending U.S. patent application Ser. No. 11/895,423 entitled “FLEXIBLE PIXEL ELEMENT AND SIGNAL DISTRIBUTION MEANS.” A portion of that teaching is the use of a plurality of discrete flexible pixel elements that can be interchangeably connected in series by means of flexible cables to produce flexible pixel strings that are conformable to irregular shapes and surfaces.

The present invention further discloses means and methods that are operative and efficacious in manufacturing discrete flexible pixel elements, including a fabrication method and means for encapsulating pixel element electronics, such as light emitting elements and collateral support electronics, and encasing the encapsulated pixel element electronics in an external top encasement cover in order to produce a unitary, hermetically sealed, self-contained module that is protected from the detrimental effects of the environment. The present invention also discloses means for connecting power and signal cables to a plurality of discrete flexible pixel elements in series connection, whereby electrical conductors and contacts within power and signal cables are similarly protected.

In summation, the prior art is generally dependent on conventional means, such as collective enclosures, to protect pixel element electronics used in electronic display devices sited outdoors from preventable failure and damage. Conventional collective enclosures are not well suited for protecting electronic display devices that conform to irregular shapes and surfaces since they are difficult and expensive to fabricate. Furthermore, they embody a single point failure mode which exposes all internal components and connections to potential failure, as well as being subject to overheating. As a result, production of such enclosures is cost prohibitive, while outcomes are often inelegant and failure prone. A novel approach to address the aforesaid deficiencies of the prior art is needed to continue to satisfy public demand and thereby ensure continuing development of the art.

SUMMARY

The general purpose of the present invention is to protect delicate and vulnerable pixel element electronics used in discrete flexible pixel elements from failure and damage due to detrimental effects of environment. More specifically, the present invention discloses a fabrication method and means for hermetic sealing of pixel element electronics embodied within discrete flexible pixel elements. The fabrication method comprises an encapsulation means and an external casement means. In addition, the fabrication method embodies connection means for connecting power and signal cables conjoining a plurality of discrete flexible pixel elements in series-connection, wherein electrical conductors and terminal contacts embodied within said power and signal cables are similarly protected.

The encapsulation means may include the use of a potting resin or gel that encapsulates said pixel element electronics and hardens on exposure to the atmosphere, heat, or a reactive agent such as a hardener. Alternatively, the encapsulation means may include the use of a ductile foam or malleable solid potting material having similar protective properties in application and which harden by similar processes to achieve similar results.

External casement means may embody a formed top encasement cover of plastic or similar material, wherein the top encasement cover has an internal cavity configured to receive encapsulated pixel element electronics in assembly. The formed top encasement cover may be transparent to pass light from light emitting elements or may have holes therein enabling the light emitting elements to protrude therefrom in order to pass light directly.

Alternatively, external casement means may embody a formed top encasement cover which has an internal cavity configured to receive pixel element electronics not yet encapsulated and which serves as a potting shell enabling pixel element electronics positioned therein to be encapsulated in situ.

In another alternative embodiment, external casement means may embody a formed top encasement cover which is formed around encapsulated pixel element electronics in a fused close fit therewith, such as by plastic forming or by an injection molding means.

In yet another alternative embodiment, the formed top encasement cover may have some corresponding fitting features adaptively to receive a barrier sealant means which may embody a ductile barrier sealant such as caulk or a malleable barrier sealant such as sealing lace or cord or a solid barrier sealant such as a sealing gasket or O-ring, wherein said corresponding fitting features engage the barrier sealant in a close fit therewith to establish a sealed barrier to atmosphere.

Connection means for connecting power and signal cables conjoining a plurality of discrete flexible pixel elements in series connection may embody formed cable connectors of plastic or similar material that house and mechanically support electrical conductors and terminal contacts, wherein said formed cable connectors and terminal contacts have corresponding fitting features which enable them to conjoin in a close mechanical fit to thereby establish series connections between a plurality of discrete flexible pixel elements, and wherein said close mechanical fit establishes a sealed barrier to the atmosphere.

According to one embodiment of the present invention, there is provided a fabrication method for hermetic sealing of pixel element electronics embodied within discrete flexible pixel elements which comprises an encapsulation means, an external casement means and a connection means for connecting power and signal cables.

According to another embodiment of the present invention, there is provided an encapsulation means that includes the use of a formed potting shell which has fitting features for receiving a pixel element electronics assembly, further presenting cavities for receiving potting material, thereby enabling the encapsulation of said pixel element electronics assembly through the introduction of the potting material, and further having fitting features for receiving components of said external casement means in a close fit therewith.

According to still another embodiment of the present invention, there is provided a potting resin or gel that encapsulates a pixel element electronics assembly which potting resin or gel hardens by exposure to the atmosphere or heat or by a reactive agent such as a hardener. The potting resin or gel is selected or formulated for optimal performance characteristics and properties efficacious for encapsulating pixel element electronics of discrete flexible pixel elements and protecting them from the detrimental effects of the environment.

According to yet another embodiment of the present invention, there is provided an external casement means which embodies a formed top encasement cover and formed bottom plate of plastic or similar material, wherein the formed top encasement cover has an internal cavity configured to receive the encapsulated pixel element electronics assembly and which further has fitting features to receive said formed bottom plate in close fit therewith, the formed top encasement cover having through holes therein to enable the light emitting elements to protrude therefrom.

According to still another embodiment of the present invention, there is provided connection means for connecting power and signal cables that embody formed connector headers of plastic or similar material which house and mechanically support electrical conductors and terminal contacts and which have fitting features enabling them to conjoin in a close mechanical fit, thereby establishing a sealed barrier to the environment.

A significant aspect and feature of the present invention is that the fabrication means which enables the hermetic sealing of delicate and vulnerable pixel element electronics contained within discrete flexible pixel elements in order to protect them from failure and damage due to the detrimental effects of the environment.

Another significant aspect and feature of the present invention is that the hermetically sealed discrete flexible pixel elements can better withstand the rough handling and mechanical shock during the shipping and assembly of electronic display devices and during required service and replacement thereof upon failure.

Yet another significant aspect and feature of the present invention is that the hermetically sealed discrete flexible pixel elements can better withstand inclement weather, moisture and humidity, electrostatic shock, thermal shock, and other detrimental effects of the environment, therefore they are better adapted for application in outdoor sites.

Still another significant aspect and feature of the present invention is that the hermetically sealed cable connectors and conductors supplying said pixel element electronics will protect the terminal connections from possible failure and damage due to rough handling and the detrimental effects of the environment.

A further significant aspect and feature of the present invention is that the hermetically sealed flexible discrete pixel elements do not require expensive collective enclosures thereby preventing individual failure of discrete flexible pixel elements and pixel element electronics embodied therein due to single-point failure of the enclosure.

A further significant aspect and feature of the present invention is that the hermetically sealed discrete flexible pixel elements will ensure greater longevity of pixel element electronics embodied therein and are more easily replaced upon failure.

A final significant aspect and feature of the present invention is that the fabrication method and means for hermetic sealing of discrete flexible pixel elements provide a robust design architecture, an improved cost-benefit in the design, manufacture and maintenance of large scale, direct view electronic display devices and signage for outdoor applications.

Having thus described embodiments of the present invention and setting forth significant aspects and features of the present invention, it is the principal object of the present invention to provide a discrete flexible pixel element that is hermetically sealed from the environment and embodied as a unitary, self-contained, replaceable module for efficient, economical production of large scale, free-form electronic displays, signs and lighting effects for outdoor applications. The present invention teaches a fabrication method for producing hermetically sealed discrete flexible pixel elements including means for encapsulating pixel element electronics, exterior casement means, and cable connector means.

BRIEF DESCRIPTION OF THE DRAWINGS

Other objects of the present invention and many of the attendant advantages of the present invention will be readily appreciated as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, in which like reference numerals designate like parts throughout the figures thereof and wherein:

FIG. 1 is an isometric view showing a hermetically sealed discrete flexible pixel element of the present invention embodying a unitary, self-contained, replaceable module;

FIG. 2 is a cross section side view of a pixel element electronics assembly attached to a potting shell with fasteners;

FIGS. 3A and 3B are isometric top and bottom views of a pixel element electronics assembly and potting shell in assembly with potting material being applied to upper and lower cavities in the potting shell;

FIG. 4 is an isometric assembly view of a discrete flexible pixel element showing a pixel element electronics assembly and potting shell in assembly, top cover and bottom gasket;

FIG. 5 is an assembled view of the components of FIG. 4;

FIG. 6A is a cross section side view of a plurality of discrete flexible pixel elements of the present invention in series connection with pixel element electronics assemblies therein fully encapsulated by potting material and attached to a planar mounting surface;

FIG. 6B is similar to FIG. 6A but with the plurality of discrete flexible pixel elements attached to a non-planar or irregular surface; and,

FIG. 7 is a cross section side view of input and output cable connectors of discrete flexible pixel elements showing corresponding mating components and applied potting material.

DETAILED DESCRIPTION

FIG. 1 is an isometric view of a preferred embodiment of discrete flexible pixel element 10 of the present invention. The flexible pixel element 10 embodies a printed circuit board assembly (not shown) on which various surface mounted electrical components are soldered or mechanically fastened to conductor pads by operative electrical connection including a plurality of light emitting elements 13, top encasement cover 30, input connector 14, output connector 16, and flexible cables 18 embodying in assembly a unitary, self-contained, replaceable module. The light emitting elements 13, or pixels, are illuminated when energized by on-board pixel element drivers (not shown) to produce a visual output in the form of emitted light. In a preferred embodiment, the light emitting elements 13 comprise a plurality of red, green and blue (RGB) colored LEDs.

FIG. 2 is a cross section side view of potting assembly 20, a top encasement cover 30, and a bottom gasket 32. Printed circuit board assembly 11 supports a plurality of surface mounted pixel element electronics 15, including light emitting elements 13 and pixel element drivers 15 a, in addition to other collateral support electronics, such as resistors and capacitors (not shown), soldered or mechanically fastened to conductor pads by operative electrical connection. The printed circuit board assembly 11 is fastened to a potting shell 22 by mechanical fasteners 29 of sufficient length for attaching said discrete flexible pixel element 10 in finished assembly to a mounting surface or back-plate 36 (see FIGS. 6A and 6B) of an electronic display device. Potting shell 22 is a formed housing of plastic or similar material that presents an upper cavity 24 and lower cavity 26 for receiving potting material. Upper cavity 24 has an upper cavity wall 24 a of sufficient height to enable said potting material to fill the upper cavity 24 to a cavity limit indicated by reference numeral 24 b, thereby to fully cover a proximal lower portion of light emitting elements 13. The electrical conductors 13 a of the light emitting elements 13, as well as the pixel element electronics 15, are completely encapsulated. However, the distal upper portions of the light emitting elements 13 are not encapsulated thus providing an unobstructed transmission of light from the flexible pixel element 10.

A lower cavity wall 26 a has a sufficient height to enable potting material to fill the lower cavity 26 to a limit, indicated by reference numeral 26 b, which is sufficient to fully cover flexible cable headers 17, 19 and a proximal portion of flexible cables 18, thereby fully encapsulating flexible cable headers 17, 19, as well as the underside of the printed circuit board assembly 11 and further providing strain relief to flexible cables 18.

FIGS. 3A and 3B are top and bottom isometric views of potting assembly 20. A potting material 28 is applied in sufficient quantity (partially shown) to fill the upper cavity 24 of potting shell 22 to the upper limit of the interior cavity wall 24 a without overflow and to fill the lower cavity 26 of potting shell 22 to the upper limit of interior cavity wall 26 a without overflow. Potting material 28 may be any conventional potting material, such as epoxy or polyurethane potting compounds, having optimal performance characteristics and properties efficacious for encapsulating pixel element electronics 15 of discrete flexible pixel assembly 10, to-whit:

-   -   (1) potting material 28 is a thermally, chemically and         electrically inert material that, when hardened, protects pixel         element electronics 15 from moisture, humidity, solar radiation,         atmospheric pressure changes, vacuum, corrosive chemicals,         electrical shock, thermal shock, mechanical shock, and other         detrimental environmental effects;     -   (2) potting material 28 is a viscous material with optimal flow         properties for application in predetermined quantities for         filling upper cavity 24 and lower cavity 26 of potting shell 22,         either by manual application or by machine application, such as         by a meter-mix-dispense (MMD) method, at optimal speed without         overflow;     -   (3) potting material 28 is a sublimating material with optimal         state change characteristics to enable rapid hardening, either         by self-sublimation through exposure to atmosphere or by use of         a hardening agent;     -   (4) potting material 28 is an adhesive material with optimal         adhesion characteristics to fully bond with interior cavity         walls 24 a, 26 a of potting shell 22 without requiring separate         adhesion means;     -   (5) potting material 28 is a volumetrically stable material that         exhibits minimum shrinkage after hardening;     -   (6) potting material 28 is a thermally conductive material with         exothermic characteristics for transmitting heat generated by         pixel element electronics 15 to the environment at a rate         sufficient to prevent thermal overload;     -   (7) potting material 28 is a strong material when hardened and         exhibits optimal compressive strength to enable mounting         discrete flexible pixel assemblies by mechanical fasteners 29         without damage; and,     -   (8) potting material 28 is a temperature resistant material when         hardened and exhibits insensitivity to ambient temperature         within an operating range optimal for use in outdoor         applications of discrete flexible pixel elements 10 in         electronic display devices.         Once applied, potting material 28 is allowed to harden in a         state change sublimation by exposure to the atmosphere or         through the use of a hardening agent, thereby completing         encapsulation of pixel element electronics 15 within potting         assembly 20.

Those skilled in the art will apprehend that the foregoing performance characteristics and properties of potting material 28 for use in discrete flexible pixel elements 10 involves various design choices and tradeoffs in the selection of optimal characteristics thereof. Accordingly, reference to the performance characteristics and properties of potting material 28 shall not be considered limiting in scope of the types and formulations of potting materials 28 that may efficaciously be used with discrete flexible pixel elements 10.

FIG. 4 is an exploded isometric assembly view of a discrete flexible pixel element 10 showing potting assembly 20, top encasement cover 30, bottom gasket 32, and potting material 28 residing in the potting assembly 20. Top encasement cover 30 is a formed housing of an optically opaque plastic or similar material that has a cavity 30 a of sufficient volume to operatively to receive an upper portion of potting assembly 20 therein and presenting a ring recess 30 b within top encasement cover 30 for receiving a corresponding ring protrusion 22 a of potting shell 22 enabling top encasement cover 30 to engage and conjoin potting shell 22 mechanically by snapping into place therewith. The top surface of the top encasement cover 30 also includes a plurality of holes 31 a-31 n for accommodating the partial protrusion of the light emitting elements 13.

Bottom gasket 32 is a formed pliable gasket of plastic, rubber or similar durable material that has a ring extension 32 a corresponding to a ring recess 34 formed by a recess 22 b in potting shell 22 and a corresponding recess 30 c in top encasement cover 30 when mechanically conjoined, as heretofore described. Bottom gasket 32 mechanically engages ring recess 34 by inserting the ring extension 32 a therein in order to effect a closure between the top encasement cover 30 at recess 30 c and potting shell 22 at recess 22 b.

Advantageously, top encasement cover 30 operatively engages with and conjoins potting shell 22, and bottom gasket 32 operatively engages with and conjoins both top encasement cover 30 and potting shell 22, by means of a mechanical fit and reliance on tension and compression forces without requiring the use of an adhesive or recourse to mechanical fasteners during assembly, thus reducing the cost of manufacture and further enabling recovery of the top encasement cover 30 and bottom gasket 32 on failure or damage of pixel element electronics 15.

FIG. 5 is an assembled view of the components of FIG. 4.

FIG. 6A is a cutaway assembly view of discrete flexible pixel element 10 showing potting assembly 20, potting material 28, top encasement cover 30, and bottom gasket 32 in final assembly embodying an hermetically sealed, unitary, self-contained replaceable module. As shown, a plurality of light emitting elements 13 protrudes through an equal plurality of through-holes 31 a-31 n in the top encasement cover 30 to present an upper portion of said plurality of light emitting elements 13 to the exterior side of top encasement cover 30 permitting an unobstructed transmission of light. Mechanical fasteners 29 may be fixedly attached to a mounting surface or to a back plate 36 of an electronic display device. Alternatively, mechanical fasteners 29 may be conjoined to a detachable footing (not shown) that allows discrete flexible pixel elements 10 to be positioned in a non-fixed condition. Input connector 14 engages with and mechanically conjoins output connector 16 a of the previous series connected discrete flexible pixel element 10 a. Output connector 16 engages with and mechanically conjoins input connector 14 b of the next series connected discrete flexible pixel element 10 b.

FIG. 6B is a cutaway assembly view similar to FIG. 6A but with a string of discrete flexible pixel elements 10 attached to a non-planar or irregular mounting surface 36.

FIG. 7 is a cutaway assembly view of input connector 14 and output connector 16 showing internal components and corresponding fitment features enabling same to engage with and conjoin in closed mechanical fitment thereby to establish a sealed barrier to the atmosphere. Input connector shell 40 is a formed housing of plastic or similar electrically nonconductive material that supports a plurality of captive input terminal contacts 41 a of flexible cable 18 a. Similarly, output connector shell 44 is a formed housing of plastic or similar electrically nonconductive material that supports a plurality of captive output terminal contacts 41 b of flexible cable 18 b. An input connector key 42 a mechanically engages with and conjoins a corresponding output connector key 42 b. An input connector protrusion 43 a mechanically engages with and conjoins a corresponding output connector recess 43 b by snapping into place. Input connector 14 with input terminal contacts 41 a mechanically engage with and conjoin output connector 16 with output terminal contacts 41 b in operative electrical connection therewith. Potting material 28 is applied to cavity 40 a of input connector housing 40 to encapsulate and seal flexible cable 18 a and providing strain relief and potting material is similarly applied to cavity 44 a of output connector housing 44 for the same purpose. Upon engagement and mechanical connection, the terminal contacts 41 a of input connector 14 engage with corresponding terminal contacts 41 b of output connector 16 in a close mechanical fit thereby effecting an operative electrical connection between the input terminal contacts 41 a and output terminal contacts 41 b and simultaneously isolating them from the outside environment by virtue of the sealed barrier to the atmosphere.

Various modifications can be made to the present invention without departing from the apparent scope thereof.

PARTS LIST

-   -   10: discrete flexible pixel element;     -   11: printed circuit board assembly;     -   13: light emitting elements;     -   13 a: electrical conductors;     -   14: input connector;     -   15: pixel element electronics;     -   15 a: pixel element drivers;     -   16: output connector;     -   17: flexible cable header;     -   18: flexible cables;     -   19: flexible cable header;     -   20: potting assembly;     -   22: potting shell;     -   22 a: ring protrusion;     -   22 b: recess;     -   24: upper cavity;     -   24 a: upper cavity wall;     -   24 b: cavity limit;     -   26: lower cavity;     -   26 a: lower cavity wall;     -   26 b: cavity limit;     -   28: potting material;     -   29: mechanical fasteners;     -   30: top encasement cover;     -   30 a: cavity;     -   30 b: ring recess;     -   30 c: recess;     -   31 a-n: holes;     -   32: bottom gasket;     -   32 a: ring extension;     -   34: ring recess;     -   36: back plate;     -   40: input connector shell;     -   40 a: cavity;     -   41 a: input terminal contacts;     -   41 b: output terminal contacts;     -   42 a: input connector key;     -   42 b: output connector key;     -   43 a: input connector protrusion;     -   43 b: output connector recess;     -   44: output connector shell; and     -   44 a: cavity.

In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Also, in the following claims, the terms “including” and “comprising” are open-ended, that is, a system, assembly, device, apparatus, article, or process that includes elements in addition to those listed after such a term in a claim are still deemed to fall within the scope of that claim. Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects.

The Abstract is provided to comply with 37 C.F.R. §1.72(b), to allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be interpreted as intending that an unclaimed disclosed feature is essential to any claim. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. 

What is claimed is:
 1. A sealed module comprising: a circuit board including one or more light-emitting elements coupled to a first surface of the circuit board; a potting shell coupled to the circuit board, the potting shell including at least one cavity, the potting shell at least partially enclosing the one or more light-emitting elements; and an encapsulating material disposed within the cavity, the encapsulating material encapsulating and sealing at least a portion of the first surface of the circuit board from an environment exterior.
 2. The sealed module of claim 1, comprising an encasement cover having an internal cavity configured to receive at least a portion of the potting shell, the circuit board, the one or more light emitting elements, and the encapsulating material.
 3. The sealed module of claim 2, wherein the portion of the first surface of the circuit board being encapsulated and sealed includes a portion surrounding each of the light-emitting elements.
 4. The sealed module of claim 1, wherein the encapsulating material encapsulates and seals at least a portion of each of the light-emitting elements.
 5. The sealed module of claim 1, wherein the at least one cavity is a first cavity and wherein the potting shell includes a second cavity extending from the circuit board in an opposed direction to the first cavity, the second cavity configured to receive encapsulating material.
 6. The sealed module of claim 1, wherein the encapsulating material comprises at least one of a ductile foam, a malleable solid potting material, a potting resin configured harden on exposure to the atmosphere, heat, or a reactive agent, and a potting gell configured to harden on exposure to the atmosphere, heat, or a reactive agent, a potting resin and a potting gel that is configured to harden on exposure to the atmosphere, heat, or a reactive agent.
 7. The sealed module of claim 1, wherein the encapsulating material hermetically seals at least the first surface of the circuit board from the environment exterior.
 8. The sealed module of claim 1, wherein the potting shell is coupled to a perimeter of the circuit board.
 9. The sealed module of claim 1, comprising one or more connectors coupled to the circuit board, the one or more connectors configured for input to the circuit board or output from the circuit board, or both.
 10. The sealed pixel module of claim 9, wherein each of the one or more connectors are configured for coupling with at least one other sealed module.
 11. The sealed module of claim 1, wherein encapsulating and sealing from the environment exterior includes protecting the portion of the first surface of the circuit board from at least one of moisture, humidity, solar radiation, atmospheric pressure changes, vacuum, corrosive chemicals, electrical shock, thermal shock, and mechanical shock.
 12. A method, comprising: providing or receiving a circuit board including one or more light-emitting elements coupled to a first surface of the circuit board; coupling a potting shell to a perimeter of the circuit board so that the potting shell at least partially encloses the one or more light-emitting elements, the potting shell forming at least one cavity; disposing an encapsulating material within the at least one cavity, the encapsulating material encapsulating and sealing at least a portion of the first surface of the circuit board from an environment exterior.
 13. The method of claim 12, comprising coupling an encasement cover to the potting shell to form a sealed module, the encasement cover having an internal cavity that receives at least a portion of the potting shell, the circuit board, the one or more light emitting elements, and the encapsulation material.
 14. The method of claim 12, wherein disposing the encapsulating material within the at least one cavity is performed subsequent to coupling the encasement cover to the potting shell.
 15. The method of claim 12, comprising coupling the sealed module to a mounting surface to form an electronic display capable of presenting graphics and video.
 16. The method of claim 12, wherein the sealed module is a first sealed module, the method comprising connecting the first sealed module to a second sealed module.
 17. The method of claim 16, wherein connecting the first sealed module to the second sealed module includes coupling an output connector of the first sealed module to an input connector of the second sealed module.
 18. The method of claim 12, comprising connecting a plurality of sealed modules to form a flexible pixel string.
 19. The method of claim 12, wherein the encapsulating and sealing at least the portion of the first surface comprises protecting the portion of the first surface of the circuit board from at least one of moisture, humidity, solar radiation, atmospheric pressure changes, vacuum, corrosive chemicals, electrical shock, thermal shock, and mechanical shock.
 20. A method comprising: providing or receiving a plurality of sealed modules, wherein each sealed module includes: a circuit board including one or more light-emitting elements coupled to a first surface of the circuit board, a potting shell coupled to the circuit board, the potting shell including at least one cavity, the potting shell at least partially enclosing the one or more light-emitting elements, and an encapsulating material disposed within the cavity, the encapsulating material encapsulating and sealing at least a portion of the first surface of the circuit board from an environment exterior; and coupling the plurality of sealed modules to a mounting surface to form an electronic display. 